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Winbond’s 4Gb LPDDR4X chip in 200B BGA package offers maximum 4267Mbps data rate at a clock rate up to 2133MHz TAICHUNG, Taiwan and Mountain View, CA– January 27, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, h...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/flex-logix-pairs-its-inferx-x1-ai-inference-with-winbond-4gb-low-power-ddr4x-in-edge-ai.html?__locale=en

(TAICHUNG CITY, Taiwan –12 September, 2019)-With the driving force of new technologies such as artificial intelligence (AI), ultra-high-resolution display, 5G mobile communication, and IoT, various kinds of new applications are emerging. Advanced Driver-Assistance Systems (ADAS), Smart Speakers, 8K ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-a-series-of-lpddr4x-at-niche-market.html?__locale=en

New W71NW20KK1KW MCP’s non-volatile Flash/high-speed DRAM combination is optimized for cost and memory capacity in static 5G modem applications (TAICHUNG CITY, Taiwan – 18 June, 2019) - Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-supports-accelerated-roll-out-of-5g-cpe-modems-with-nand-lpddr4x-multi-chip-.html?__locale=en

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