Winbond Will Join FMS on Santa Clara Convention Center

[Event Information]

FMS: The Future of Memory and Storage is the premier international showcase for the memory and storage industry, featuring cutting-edge technologies, leading company keynotes, and extensive sessions on emerging solutions. The scope of FMS will include DRAM, DNA data storage, UCIe chiplet interconnects, Compute Express Link (CXL), wearables, automotive, AI/ML, data centers, and entertainment applications, along with 3D flash, NVMe, ZNS, and important industry announcements.

[Product Information]

You will find 3 product lines with its highlight products at Winbond booth.

• Code Storage Flash Memory
  
  • Firmware Update Time Comparison Demo on Edge Computing Platform - SPI NOR vs QspiNAND
  • New 512Mb Octal NOR Flash with 400MB/s Data Throughput
  • 1.8V 16Mb Serial NOR Flash memory
  • 1.8V OctalNAND operation max. CLK is 120MHz

•  Specialty DRAM and Mobile DRAM
  • DDR3L and HYPERRAM with STM32 series
  • 4Gb LPDDR4 with Mobileye EyeQ4H for ADAS Application
  • LPDDR4 with Flex Logix InferX X1

• TrustME®
  • W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT and POS and so one.

[Register]

For more information about Winbond product and demo, please come and visit us on booth 791. Click the link to register FMS!

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME^® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event contact
Yulia Lee
Digital Marketing Manager
TEL: 886-3-5678168 Ext.75395
E-mail: YLLI5@winbond.com