Winbond at Embedded World 2020(Cancelled)

  • Date:
    Date: 25 - 27 February 2020
    Nuremberg, Germany

This is our first time to attend Embedded World as an exhibitor and Winbond we are so excited to meet our customers in person at the show.
At Embedded World 2020 this year, we will announce several new product innovations and show some outstanding demos, which is the reason why we would like to invite you to visit us at Winbond booth 4A-121.

Come to schedule a meeting with us by clicking FORM.

In the next few years, the development of AI and 5G technologies will significantly push up IoT to the next level, while edge computing on each terminal devices will create the demand for product generation conversion, automotive electronics and industrial IoT will be more flourishing.

Winbond is ready and we are everywhere in your life.

You will find 3 product lines 4 solutions 5 innovations at Winbond booth.

3 Product lines:

4 Solutions:

5 Innovations:


You won’t want to miss it! See you soon.


About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond’s headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong.
Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

For more information, please visit: www.winbond.com

Event contact
Yulia Lee
Digital Marketing Manager
TEL: 886-3-5678168 Ext.75395
E-mail: YLLI5@winbond.com

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