Winbond Electronics Corp. CompletesUS$70 Million Four Year Syndicated Term Loan Facility with Chinatrust Financial Holding Co. and First Commercial Bank

Winbond Electronics Corp. has signed a 4-year US$70 million syndicated term loan facility with 11 Taiwanese banks on June 30, 2005. The purposes of the Facility are to finance the purchase of assets of the Advanced PC (APC) Division of National Semiconductor Corporation and to finance the general working capital of Winbond.

The syndication ceremony is co-hosted by Arthur Chiao - Chairman of Winbond, Eric Chen - President of Chinatrust Financial Holding Co., Ltd., and Abel Liu - Executive Vice President of First Commercial Bank. Other bank participants include Taipei Fubon Commercial Bank, Bank of Overseas Chinese, Central Trust of China, Fuhwa Commercial Bank, E-Sun Commercial Bank, The Shanghai Commercial & Savings Bank, Land Bank of Taiwan, Chang Hwa Commercial Bank and Hwatai Commercial Bank.

Winbond is a leading supplier of the Input / Output (I/O) controller for PC motherboard applications. By acquiring the intellectual property and assets of the APC Division from National Semiconductor, Winbond is able to create a synergy amongst its original I/O for desktop PC products, APC's notebook PC and server I/O products. The newly acquired APC division is known as the pioneer in providing the Trusted Platform Module (TPM) function amongst PC I/O suppliers. This technology can also be applied towards applications for Network Access and Mobile Phone products, thus increasing Winbond's overall product line competitiveness. In addition, the delivery of high-end mixed signal, I/O and advanced system solutions has already contributed to Winbond's May revenue, and also improved customer satisfaction by providing a one-stop shopping experience. 

Winbond is known as a leading integrated device manufacturer (IDM) in the Taiwan IC industry. To meet the surge in demand for high-density memory ICs in mobile phones, Winbond began its strategic transformation in 2001 and positioned itself as a Mobile Electronics Solution Provider and emphasized on new product development and provided value-added services. Winbond's 2004 annual revenue was NT 31.215 billion, an increase of 6 percent, when compared to the Company's 2003 annual revenue. This is mainly due to the good sales results of Mobile Phones and increased shipments of Pseudo SRAMs. The Company showed a steady gross margin increase in the last three years, mainly due to Winbond's successful transition and effective capacity utilization for the higher-margined Logic IC products. Pseudo SRAMs, also a high gross margin product, also contributed to the revenue.


    Wilson Wen
    Vice President of Administrative Center

News Liaison
    Mike Liu
    Deputy Director

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