Winbond Electronics Corporation Signed a NT$ 7 Billion Syndicated Loan Agreement with 16 Domestic Banks

Taichung, Taiwan, May 31, 2010-Winbond Electronics Corporation today announced that it has signed a NT$ 7 billion five-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Miss Susan S. Chang, Chairman of Taiwan Bank at the Department of Public Treasury of Taiwan Bank. The main purpose of the agreement is to finance technology upgrade as well as general working capital of the Company.

The syndicated loan was led by Taiwan Bank, Chinatrust Commercial Bank, First Commercial Bank, Taiwan Cooperative Bank, Taishin International Bank, E.Sun Bank and consisted of other ten financial institutions, all of which are with excellent operation performance. The enthusiasm received from the financial institutions represents their highly support to Winbond’s well credit rating and bright future.

Winbond is a leading supplier of Specialty Memory. The Company’s 300mm wafer fab manufacturing Specialty DRAM, Mobile RAM, NOR Flash and Graphics DRAM has reached 35,000 wafers capacity per month.  The capital acquired from this syndicated loan will be used to implement technology migration, acting as the driving force for strengthening the Company’s product portfolio and competitive advantage.

    James Wen
    Vice President of Finance Center & CFO

News Liaison
    Ivy Hsu
    Professional Assistant Manager

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