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Winbond Electronics Corporation Signed an NT$ 7 Billion Syndicated Loan Agreement with 17 Domestic Banks

Hsinchu, Taiwan, Sep. 19, 2011-Winbond Electronics Corporation today announced that it has signed an NT$ 7 billion five-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Miss Susan S. Chang, Chairwoman of Bank of Taiwan at Sherwood Hotel Taipei. The main purpose of the syndication loan is to finance the equipment procurement for technology upgrades.

The syndicated loan was led by Bank of Taiwan, Chinatrust Commercial Bank, First Commercial Bank, Taiwan Cooperative Bank, Taishin International Bank, E.Sun Bank, Taipei Fubon Commercial Bank ,DBS Bank and consisted of nine other financial institutions. Thanks for the participation of these banks, the loan subscription was over NT$10 billion and final facility amount was closed at NT$ 7 billion. The oversubscription represents highly support of financial institutions to Winbond’s credit rating and positive business prospects.

Winbond is a leading supplier of Specialty Memory with three major product lines of Specialty DRAM, Mobile RAM, and NOR Flash. Along with the syndication loan, advanced technology migration and forthcoming 46nm products mass production will enable the company to provide complete product  mix to world-class customers. The company expects to deliver stable profitability and sustainable long term competitive advantages in the future.


                                           


Spokesperson

    James Wen

    Vice President of Finance Center & CFO

    Tel:03-5678168

 

News Liaison

    Vick Liu

     Investor Relations Dept.

     Tel:0966-233361

     Email:HYLiu4@winbond.com

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