Winbond Electronics Corporation Signed an NT$ 12 Billion Term Loan Agreement

Hsinchu, Taiwan, August 15, 2016- Winbond Electronics Corporation today signed an NT$ 12 billion five-year term loan agreement with Bank of Taiwan, CTBC Bank, First Commercial Bank, Taishin International Bank, DBS Bank, Chang Hwa Commercial Bank, Taiwan Cooperative Bank (leading banks) and other ten financial institutions (participating banks). The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Ms. Jih-Chu Lee, Chairperson of Bank of Taiwan at Regent Hotel, Taipei. The loan was oversubscribed and closed at NT$ 12 billion. This indicates banks’ recognition of Winbond’s credit standing and positive outlook.

The main purpose of the syndication loan is to finance the company’s capital expenditure, including construction of Fab C, equipment for advanced process technologies, and refinancing existing term loan. With funds in place, Winbond will be able to achieve stable growth of bottom line.
Winbond is a leading supplier of Specialty Memory with major product lines including Specialty DRAM, Mobile DRAM, and Code Storage Flash. In order to fulfill customers’ needs, it has been dedicated to adding product value and strengthening competitiveness with better product mix, quality control, and capacity optimization.


Ms. Jessica Chiou-Jii Huang
Tel:(03)5678168 /0987-365682

News Liaison :
Mandy Wang
E-mail: YCWang16@winbond.com

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