Winbond Electronics Corporation Secured an NT$42 Billion 7-year Syndication Loan Agreement

Hsinchu, Taiwan,January 14, 2019- Winbond Electronics Corporation today secured an NT$42 billion 7-year syndication loan. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. Joseph Jye-Cherng Lyu, Chairman of Bank of Taiwan at Le Meridien Taipei. There are total 19 well-performed financial institutions participating in this deal. The leading banks are Bank of Taiwan, CTBC Bank, First Commercial Bank, Taishin International Bank, Mega International Commercial Bank, Taiwan Cooperative Bank, Chang Hwa Commercial Bank, and DBS Bank Ltd.

This syndication loan is to finance the company’s capital expenditure, including new Fab construction at Kaohsiung Science Park of Southern Taiwan Science Park (STSP) and the purchase of machinery and equipment. In the future, Winbond will take steady steps in new Fab planning and investment to meet growing customer demands. This syndication loan was strongly supported by banking sectors with oversubscription by 1.93 times and finally closed the deal at NT$42 billion.It indicates that the syndicate banks highly recognize Winbond’s solid business performance.

Winbond Electronics devotes to total memory solutions. We are ranked as the world's top five branded DRAM manufacturer, and the leading supplier of NOR Flash. Winbond is one of a handful of memory solution providers with both DRAM and Flash product lines in the world. With the growing diverse memory applications, Winbond’s newly added capacity, together with in-house technologies and flexible production allocation capability will enable the company to fully grasp the market opportunity and increase its market share.


Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer

News Liaison
Mandy Wang
Investor Relationship Dept.
886-3-5678168 #71477

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