Winbond Electronics has come up with a new low-density DDR3 SDRAM to fulfill the demand of new applications

Nowadays, info-electronic devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and down-sizing. Fully understanding market demand, Winbond, one of the leading manufacturer of specialty DRAM has come up with the first low density 512Mb DDR3/3L SDRAM appeared on the market. The latest 512Mb DDR3/3L SDRAM not only provide high-speed 1600Mbps performances, it also meet the industrial standard and can remain operating under extreme environment temperature ranged from-40℃ ~ 105℃. With its strong experiences and knowledge accumulated over the past few decades, Winbond designed this new product with high compatible ability and stability. It can provide strong performance in various kind of applications including SSD, networking, printer, power equipment and other consumers or industrial platforms。

This latest product has 2 kinds of I/O interface: x8 and x16. For packaging, it support FBGA-78 or FBGA-96. All packaging and its process follow the regulation of RoHS and JGPSSI. Additionally, Winbond also provides KGD services, all technical requests from customers when applying KGD in SiP process are already take under concern in the very beginning. As a result, the new product uses the “one side edge pad” design in order to make it easier to use for the customers, and also reduced the cost。

Terminal systems are facing more and more different requests from different applications on the market, so it often has to be designed in very elastic way. What’s more critical, the most compatible memory must be defined. Winbond has very complete product lines including specialty DRAM, mobile DRAM and Flash memory with different density, speed and operating voltage that can adapt to different applications. With the support of professional engineering team and a self-owned 12 inch FAB, Winbond’s products are guaranteed with high quality & production capacity, and can provide all-around high competitive solutions to customers。

 If you need further information including L/T, prices, datasheets, requesting samples or placing orders, please contact directly with local Winbond sales rep or send your requests to SDRAM@winbond.com。

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan.  Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2015 close to US$1 billion. Winbond has approximately 2,400 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA.  For more information, please visit: www.winbond.com


*Note: Winbond is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners



Product Contact

  Robert Chang

  Director of Specialty DRAM Marketing Division

  TEL: 886-3-5678168 ext. 75377

  E-mail: YCChang11@winbond.com


News Contact

  Jenny Chen

  Sales Promotion Department

  TEL: 886-3-5678168 ext. 76333

  E-mail: WCCHEN22@winbond.com



  Jessica Chiou-Jii Huang

  Vice President & Chief Financil Officer

  TEL: 886-3-5678168 / 0987-365682


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