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Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB. This benefit becomes more critical in small PCBs for applications like modules and designs with a small PCB area, particularly for mobile and portable applications.

Self-owned DRAM and SLC NAND Flash Technology

Winbond Electronics Corp. is a Memory IC Company engaged in DRAM and Flash design, manufacturing and sales services. From product design, research and development, wafer fabrication to marketing of brand name products, Winbond endeavors to provide its global clientele top quality of low to medium density memory solutions.

Self-owned 12-inch fab

Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of SLC code storage NAND flash memory and Mobile DRAM products. Our in house wafer fabrication provides customers with full commitment in capacity support as well as delivery flexibility.

Longevity Support

Winbond Electronics Corporation, a longtime provider of memory semiconductors, is now offering a Winbond Product Longevity Program (WPLP) for applications that require long-term support which offers stability and longevity for long-life applications that need support for 5+ to 10 years.

 

Ball Package Size
(mm)
MCP Part Number Density I/O Bus DRAM
Type
Status1,2
Flash DRAM Flash DRAM
 130 8x9x1.0  W71NW10GC3DW 1Gb  512Mb 8 32   LPDDR1 P
W71NW10GC1DW 1Gb  512Mb 16   LPDDR1
W71NW11GC1DW 1Gb 512Mb 16  16   LPDDR1
W71NW11HC1DW 1Gb  512Mb 16  16   LPDDR1
W71NW20GD3DW 2Gb 1Gb 32   LPDDR1
W71NW20GD1DW 2Gb 1Gb 16   LPDDR1
W71NW21GD1DW 2Gb 1Gb 16  16   LPDDR1

 

 

 

 

 

 

 

  

Ball Package Size
(mm)
MCP Part Number Density I/O Bus DRAM
Type
Status1,2
Flash DRAM Flash DRAM
 121  8x8x0.8 W71NW11GE1EW 1Gb 512Mb 16 16 LPDDR2 P
W71NW11GF1EW 1Gb 1Gb 16 16 LPDDR2 P
 162  8x10.5x1.0 W71NW10GE3FW 1Gb 512Mb 8 32 LPDDR2 P
W71NW10GF3FW 1Gb 1Gb 8 32 LPDDR2 P
W71NW20GF3FW 2Gb 1Gb 8 32 LPDDR2 P

  

 

 

 

 

 

Status1: P= Mass Production, S (Time) =Samples (Ready Time), UD (Time) =Under Development (Ready Time), N=Not recommended for new designs.

Status 2: All Winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

 

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