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Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM TAICHUNG, Taiwan – December 16, 2020 – Winbond Electron...

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(HSINCHU, Taiwan –29TH April, 2020) -- With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (AI) technologies, the emerging application w/ AI engine boosting to be powerful and popular in coming years. To image that the affordable AIoT device can guide people how to...

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Winbond supplies the low-power, high-bandwidth 1Gb LPDDR3 DRAM die in the KL720 SoC Kneron’s KL720 with Winbond DRAM inside sets new industry benchmark for power/performance ratio in edge AI applications TAICHUNG, Taiwan – September 22, 2020 – Winbond Electronics Corporation, a leading global suppli...

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