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Winbond develops Mobile memory components with low power consumption, supporting not only smartphones and tablets but also extending to mobile consumer electronics and mobile communication applications. Winbond's Mobile DRAM devices support both x16 and x32 data bandwidths. The Mobile DRAM devices f...

https://www.winbond.com/hq/hq/product/customized-memory-solution/lpddr-lpsdr/index.html?__locale=en

Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application Winbond Announces New 512Mbit mobile LPSDRAM Mar/31/2011 512M mobile LPSDRAM W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths W949D6C, W949D2C, Mobile LPDD...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-announces-512mb-mobile-lpddr-lpsdram-for-mobile-display-data-communication.html?__locale=en

Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=en

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=en

Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=en

Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-unveils-256mb-low-power-dram.html?__locale=en

Booming of Massive IoT According to the mobility report published by Ericsson in June, 2020, Massive IoT, including NB-IoT and Cat-M, continues to be deployed around the globe. Owing to the fact COVID-19 blocks transportation, the process of penetration is lower than we expected. Most of IoT applica...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/what-is-the-best-dram-choice-for-iot-applications.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W989DXDB.html&level=1

What is HyperRAM™? Before knowing HyperRAM™, one should understand HyperBus™ first. HyperBus™ technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus™ interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system per...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/what-you-need-to-know-about-hyperram.html?__locale=en

(Taipei News) Apr. 29, 2005 - Winbond Electronics Corporation today announced, in its 1Q investor meeting, the roadmap and advantages for the Memory Business Group. Winbond's Memory Business Group will focus more on developing 1T PSRAMs, LP SDRAMs and manufacturing low-density Flash products by usin...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00040.html?__locale=en

(Taipei News) Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced the results of its Board of Directors meeting held on April 28, 2006. The Company approved audited financial statements for the first quarter of 2006. Net sales totaled NT $6.206 billion. Ne...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00167.html?__locale=en