Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007.
LP SDR/DDR will become Mainstream
In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this development in a hitherto mature market has been the availability of new technologies and platforms, including the 3G communication standard, built-in digital cameras and MP3 functions, and the introduction of Mobile TV.
The rapid changes in mobile device specifications have stimulated demand for increased memory capacity. Winbond's Low Power DRAM, with very large capacity - 128 Mb to 1 Gb, and maximum operating frequency - 80 to 166 MHz, is exactly what this market requires.
The W988D6E/W988D2E Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) key features are:
- Conforms to the unified industry standard (JEDEC)
- 256 Mb (4M x 4 bank x 16, 2M x 4 bank x 32)
- Low operating voltage and input/output voltage: 1.8V
- Lower power consumption
- Max. operating frequency: 133 MHz
Target Application Market
The Low Power SDR/DDR SDRAM is designed for mobile devices. This target market includes premium smart phones, mid-range/premium digital cameras, global positioning system (GPS) devices, MP3 players, PDAs and more.
Industry Standard
Unlike Pseudo SRAM, for which no uniform standard exists, the Winbond Low Power DRAM conforms to the JEDEC specifications for both functionality and pin definitions, making it easy for users looking for an alternative source.
About Winbond
Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.
Winbond owns two business groups:
- Logic IC Business Group ------ focuses on two specific sectors including µ c-based consumer ICs and computer logic ICs.
- Memory IC Business Group -- is dedicated in Mobile RAM and Flash Memory. It covers major products in the field of low power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash Memory etc.
Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.
More information about 2007 IIC-China, visit: http://www.english.china.iicexpo.com/
Product Contact:
S.F. Chen
Mobile RAM Marketing
TEL: 886-3-5678168#6680
Email: SFChen1@winbond.com