Milestones - Winbond

Date

Milestones
Date 2024/12

Milestones WEC Carbon Accounting Platform Go Live (Carbon Inventory + Carbon Footprint)
Date 2024/12

Milestones Awarded the 2024 National Sustainable Development Award, the TCSA Taiwan Top 100 Sustainable Companies Award, and six individual performance awards
Date 2024/10

Milestones Achieved TIPS (Taiwan Intellectual Property Management System) A-level certification for the second consecutive year
Date 2024/10

Milestones Awarded the Department of Industrial Technology, MOEA's IC Design Subsidy Program for the 3D CUBE Innovative Service Application Platform Project
Date 2023/09

Milestones Winbond introduces innovative CUBE architecture for powerful edge AI devices
Date 2023/08

Milestones Mass production of DRAM product with self-developed 20nm process technology
Date 2023/07

Milestones Successful verification of NOR Flash product with self-developed 45nm process technology
Date 2023/03

Milestones Winbond Group Recognized as a “Top 100 Global Innovator 2023”
Date 2022/12

Milestones Kaohsiung Fab has passed the verification for quality system and international standards for environment, safety, and health. The first batch of self-developed 25Snm DRAM products, with the first 4G DDR3 product shipped in September, achieved qualification and entered into mass production in December
Date 2022/11

Milestones Winbond won “Corporation Comprehensive Performance - Top 100 Taiwanese Companies Sustainability Awards”, “Corporate Sustainability Report - IT & IC Manufacturing Platinum Award”, and “Best Sustainability Practice Awards - Talent Development Leadership Award” in the Taiwan Corporate Sustainability Awards (TCSA) 2022