Winbond Announces New Flash Memory Products - 16Mb/32Mb/64Mb Parallel Flash

16 Mb (W19B160B), 32 Mb (W19B320B) and 64 Mb (W19B640C) parallel flash memories 

(Hsinchu, Taiwan – Sep 17, 2007)Over the past 12 years, Winbond has devoted itself to the flash memory market, increasing its product competitiveness and improving market share. In 1995, Winbond manufactured its first 5V flash memory in a 6-inch fab. In 2003, using its 0.18 μm WinStack process technology in an 8-inch fab, Winbond manufactured 4 Mb, 8 Mb FWH and LPC low-density flash memories, achieving a market share of over 50% in motherboard products. In 2007, Winbond launched the W19B family of 16 Mb, 32 Mb and 64 Mb parallel flash memories, manufactured using WinStack technology. With this expanded product range, Winbond was able to extend flash memory applications beyond PC-related fields to the areas of consumer electronics and networking.

The W19B160B and W19B320B are 16 Mb and 32 Mb devices, respectively, supporting x8/x16 data widths. Random access speed can reach 70 ns at operating voltages of 2.7V-3.6V. Major features include erase Suspend/Erase resume, Top or Bottom Boot Block, Write-Protection and Hardware Reset. They are ideal for DVD players and recorders, MP3 players, printers, networking, set-top boxes, projectors, automotive applications, consumer electronics, gaming devices and mobile devices. In addition, the 32 Mb W19B320B offers a security sector to protect critical code for customers.

The 64 Mb W19B640C supports all W19B320B features and also includes 20 ns page mode access speed and Flexible Bank architecture, for simultaneous read/write operation. It is ideal for consumer applications such as DSC, DVD recorder, STB(DVB-C), high-end networking applications and low-price handsets. All W19B family package/pinouts and command sets are JEDEC standard compatible.

In 2008, to maintain its competitive edge, Winbond plans to manufacture 16 Mb, 32 Mb, 64 Mb and 128 Mb parallel flash memories, using Winbond's leading 0.09 μm WinStack process technologies.

Availability and Pricing

W19B160B 48-pin TSOP samples will be available in June 2007; production will be in August 2007. 48-ball TFBGA samples will be available in October 2007; production will also be in October 2007.

W19B320B 48-pin TSOP package samples will be available in September 2007; production will be in the beginning of Q4 2007. 48-ball TFBGA samples will be available in Q4 2007.

W19B640C 48-pin TSOP samples will be available in Q4 2007; production will be in Q1 2008. 48 ball TFBGA samples will be available in Q1 2008.

For specific lead-time, pricing and additional information, please contact your local Winbond representative or distributor.

About Winbond

Winbond Electronics Corporation, a leading provider of IC-based solutions was founded in Hsinchu Science Park, Taiwan in 1987. The company has first-rate capabilities in product design, research and development, manufacturing, marketing and sales. Winbond's two business groups each focus on specific sectors:

Winbond operates one 300 mm wafer fab, two 200 mm wafer fabs* and one 150 mm wafer fab. The company currently has over 5,000 employees, and holds more than 2,500 patents worldwide. Winbond also has subsidiaries in Mainland China, the United States, Japan and Israel. For more information, visit: http://www.winbond.com.

*Note:Winbond officially announced the sell of 200mm fabs to Vanguard International Semiconductor Corporation (VIS) on March 22nd, 2007. The property transfer time is scheduled to be on January 1st, 2008.


Product Contact:
Kuo-Hsiung Lin
NVM Product Marketing & Planning Div.

News Contact:
Erin Chou
Sales Promotion Dept.

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