Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 to Sep.8
Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM, will be shown at this show.

Low Power DRAM

In recent years, rapid changes in mobile device specifications which have stimulated demand for increased memory capacity, especially for Multimedia-rich and wideband applications. Winbond's Low Power DRAM family provides both LPSDR and LPDDR, with very large capacities – 128 Mb to 512 Mb. The entire family conforms to JEDEC specifications for both functionality and pin definitions, making it easy for users looking for multiple sources.


Pseudo SRAM enables faster memory speed as a device for the access of  for mobile applications. PSRAM features a standard SRAM interface, 1-transistor DRAM-like memory cells and an on-chip refresh circuit, which make it an easy design-in. For added flexibility, Winbond’s PSRAM family provides data densities from 16 Mb to 256 Mb. The 256 Mb PSRAM, which complies with Cellular RAM 2.0G Standard, has one of the highest densities available in the market.

Winbond and Qimonda AG (June 27th) announced the signing of a new agreement for the transfer of 75 nm and 58 nm DRAM trench technology, and for production capacity collaboration. This agreement illustrates Winbond's commitment to implementing advanced production technologies to strengthen the competitiveness of its brand-name products in the global market, and to reinforce its technology partnerships with leading international companies.

About Winbond

Winbond Electronics Corporation, a leading provider of IC-based solutions was founded in Hsinchu Science Park, Taiwan in 1987. The company has first-rate capabilities in product design, research and development, manufacturing, marketing and sales. Winbond's two business groups each focus on specific sectors:

• Logic IC handles µc-based consumer ICs and computer logic ICs.
• Memory IC is dedicated to Mobile RAM and Flash memory. Its major products include low-power DRAM, specialty DRAM, Pseudo SRAM, commodity DRAM, and low-density Flash. 
Winbond operates one 300 mm wafer fab, two 200 mm wafer fabs* and one 150 mm wafer fab. The company currently has over 5,000 employees, and holds more than 2,500 patents worldwide. Winbond also has subsidiaries in Mainland China, the United States, Japan and Israel. For more information, visit: http://www.winbond.com

*Note:Winbond officially announced the sell of 200mm fabs to Vanguard International Semiconductor Corporation (VIS) on March 22nd, 2007. The property transfer time is scheduled to be on January 1st, 2008.

Product Contact
Rex Liu
Mobile RAM Marketing Div.
TEL:886-3-5678168 ext:6091
Email:  HHLiu2@winbond.com

News Contact
Erin Chou
Sales Promotion Div.
TEL:886-3-5678168  ext:8686

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