MCP

W71N Space Efficient Integrated Memory Solution

The W71N MCP combines 1.8V ONFI NAND with LPDDR2 or LPDDR4x in a single, compact package to simplify PCB design. By integrating these memories, the solution delivers a highly efficient memory footprint that saves board space and streamlines system design, enabling more compact and efficient devices. In addition, the close integration reduces data transfer latency between chips, enhancing overall performance and making W71N MCP an ideal choice for high-integration applications, especially in compact, mobile, and space-constrained systems.

Winbond is a leading memory IC company specializing in DRAM and Flash. With fully in-house capabilities covering design, research and development, and 12-inch wafer fabrication, Winbond offers flexible delivery and strong supply continuity. This vertically integrated manufacturing model ensures stable sourcing for W71N MCP NAND + DRAM, eliminating shared sourcing risks. Backed by its Product Longevity Program (WPLP), Winbond provides long-term support for 5 to 10 years or more, making it an ideal partner for long-life and embedded applications.

Series List