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In addition to ultra-high-speed data processing, modern IoT devices require long-lasting batteries. To achieve this, onboard RAM needs to operate efficiently by using the lowest possible power settings. Low power synchronous dynamic RAM (Low power SDRAM) integrates energy-saving technology that allo...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-sdr-sdram/index.html?__locale=en

The use of double data rate synchronous dynamic random-access memory (DDR SDRAM) in modern IoT devices has significantly improved computer data processing. While DDRs allow faster data transmission than single rate memories, the improved performance often translates to greater power consumption. Low...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr2-sdram/index.html?__locale=en

Mobile phones have become an integral part of our daily lives providing a compact platform for work and play. With newer software requiring faster computing, optimized RAM makes all the difference. Low power DDR SDRAM is a synchronous DRAM optimized for numerous IoT applications. SEARCH FOR THE PROD...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr-sdram/index.html?__locale=en

With the increasing functionality of IoT processes, mobile device developers are constantly searching for smaller, faster memory chips to integrate into their products. While standard DDR RAM chips are optimized for ultra-fast data processing, low power variants like the LPDDR3 are an excellent choi...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr3-sdram/index.html?__locale=en

Low-Density Memory for AI-Enabled Devices Many smartphones, smart vehicles, wearables, and several other IoT devices now integrate edge AI to optimize their processes. These devices require ultra-fast data processing memories to perform optimally. Low power DDR4 SDRAM especially the LPDDR4X variants...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr4-ddr4x-sdram/index.html?__locale=en

Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=en

Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=en

Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=en

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-<span class="match">low-power</span> (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/Ultra-Low-Power-DRAM-A-Green-Memory-in-IoT-Devices

Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0615_winbond_next_generation_8mb_serial_flash_edge_device_constrained_iot_applications.html?__locale=en

Taichung, Taiwan – 2024-08-07 - Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with low standby...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=en

Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM TAICHUNG, Taiwan – December 16, 2020 – Winbond Electron...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-1gb-lpddr3-in-tsing-micro-new-ai-image-processing-soc.html?__locale=en