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Keyword search results for “ BOM ”, 7 Matches

How efficient memory solutions can help designers of IoT nodes meet tight BoM cost targets

Technical Article

Industry’s vision for the Internet of Things (IoT) foresees the installation of billions of devices connected to the world’s universal network. All forecasts for the numbers of IoT nodes are huge. Simple mathematical reasoning suggests that the average production cost per node must be small, otherwi...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-efficient-memory-solutions-can-help-designers-of-iot-nodes-meet-tight-bom-cost-targets.html?__locale=en
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Winbond 1.2V Serial NOR Flash Product Brief

Code Storage Flash Memory

1.2V Serial NOR Flash

Product Brief

https://www.winbond.com/productResource-files/Winbond 1.2V Serial Flash Product Brief_EN_20250226.pdf
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https://www.winbond.com/hq/hq/support/faq/technical/.content/faq/faq00004.html?__locale=en
Code Storage Flash Memory - 1.2V Serial NOR Flash

1.2V Serial NOR Flash

The W25QxxND 1.2V series of Serial NOR Flash has performance identical to the popular 3V and 1.8V families of serial flash with the added benefit of saving power. Packages offered: 2mm x 3mm USON8 narrow 150mil SOP8 6x5mm WSON 8-pin KGD (Known Good Die) The packages offered provide designers with th...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/index.html?__locale=en
Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part

News

New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en
Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

News

TAICHUNG, Taiwan and YOKOHAMA, Japan– 2021-07-07 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM™ and SpiStack® (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm®-based microprocessors (MPUs...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-and-spistack-and-renesas-rza2m-accelerate-embedded-ai-system.html?__locale=en
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