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High Quality SLC NAND provides new pathway to higher density code memory in Automotive applications
Code Storage FlashQSPI NANDOctal NANDONFI NANDTechnical Article
The two broad categories of non-volatile Flash memory are known by every hands-on system designer. There is NOR Flash, which is a robust and reliable memory which can store data for long periods. It is produced in relatively low densities of 256Mb and less, and has a relatively high cost-per-bit. An...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/slc-nand-provides-new-pathway-to-higher-density-code-memory-in-automotive.html?__locale=en
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Winbond Electronics Corporation Signed a NT$ 15 Billion Syndicated Loan Agreement with Bank of Taiwan and Other 21 Financial Institutions
News
To meet the mid- and long- term capital demands for its 12-inch fab expansion plan in the Central Taiwan Science Park, Winbond Electronics Corporation today announced that it has signed a NT$ 15 billion five-year syndicated loan agreement. The signing ceremony was hosted today by Mr. Arthur Y.C. Chi...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00158.html?__locale=en
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Winbond presents 2023 Winbond Carbon Neutral Family Day and Winbond Corporate Song in response to environmental sustainability
News
2023 Winbond Carbon Neutral Family Day, centered on the theme ' Embracing AI for a Sustainable Green Future,' continues the focus on sustainable environmental initiatives. Family day today was held at the National Palace Museum Southern Branch, and it symbolizes the company's commitment to leading t...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00492.html?__locale=en
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Winbond introduces new class of high-quality NAND Flash to provide lower cost alternative to NOR Flash for code storage in mission-critical applications
News
High Quality NAND Flash from Winbond to give automotive system manufacturers new pathway to higher-density code memory as NOR Flash scaling reaches its limit NUREMBERG, Germany and TAICHUNG, Taiwan – 27 February, 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor mem...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-new-nand-flash-to-provide-lower-cost-alternative-to-nor-for-code-storage.html?__locale=en
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Winbond Electronics Presents Low Power Mobile Memory
News
Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-presents-low-power-mobile-memory.html?__locale=en
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What You Need to Know about HyperRAM™ – An Alternative Memory Option
Technical Article
What is HyperRAM™? Before knowing HyperRAM™, one should understand HyperBus™ first. HyperBus™ technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus™ interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system per...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/what-you-need-to-know-about-hyperram.html?__locale=en
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Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
News
TAICHUNG, TAIWAN–2022-12-09—Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that it has been awarded the 7th China IoT Technology Innovation Award 2022 by Elecfans for its continuous pursuit of technological innovation and excellent produ...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_hyperram_wins_china_iot_innovation_awards_2022.html?__locale=en
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Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif
News
Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launches-low-power-mobile-memory-in-2007-hongzhou-eif.html?__locale=en
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Winbond Announces Monthly Revenue for May
News
(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of May, 2009. Revenue for the month was NT$ 1.369 billion, a decrease approximately 4.31 percent when compared with NT$ 1.430 billion in the previous month. Accumulated revenue for January to May of 2009 ...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00224.html?__locale=en
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How improved die-stacking technology reduces pin count, board footprint and system complexity
Technical Article
The direction and force of consumer demand is relentless: buyers of mobile and computing devices are constantly looking for products that offer more features and better performance in a smaller, lighter, sleeker form factor. Applications that once would have required a laptop have migrated to the sm...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-improved-die-stacking-technology-reduces-pin-count-board-footprint-system-complexity.html?__locale=en
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Check connection between SOC and DRAM with IC Boundary Scan Technology
Technical Article
With more complex application being put into modern electronic devices, higher throughput is expected within the IC. We could achieve this goal by speeding up the clock, or by adding more IOs. A higher clock will lead to Signal Integrity (SI) issue, like crosstalk, Electromagnetic Interference (EMI)...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/connection-between-soc-and-dram-with-ic-boundary-scan-technology.html?__locale=en
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Winbond Electronics Corporation Announces The Resignation of Vice Chairman Ding Yuan Yang
News
(Hsin Chu News) Winbond Electronics Corporation today announced the resignation of Winbond's Vice Chairman, Dr. Ding Yuan Yang. Dr.Yang's resignation began January 1, 2002. Vice Chairman Yang is resigning to devote more time to personal pursuits. In 1987, Dr.Yang, along with a group of talented tech...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00024.html?__locale=en
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Winbond moves into HyperRAM™ market to address new AIoT application needs
News
(HSINCHU, Taiwan –30 October, 2019) With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU supp...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-can-address-new-aiot-application-needs.html?__locale=en
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Winbond Announces Monthly Revenue for April
News
(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of April, 2009. Revenue for the month was NT$ 1.430 billion, an increase approximately 31.32 percent when compared with NT$ 1.089 billion in the previous month. Accumulated revenue for January to April of...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00223.html?__locale=en
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New generation of wearable medical devices calls for secure, high-density non-volatile memory
Technical Article
As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly look...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/new-wearable-medical-devices-calls-for-secure-high-density-memory.html?__locale=en
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