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https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/CUBE-Powering-the-Next-Generation-of-Edge-AI-Devices

https://www.winbond.com/hq/about-winbond/news-and-events/news/2026_1104_winbond_cube_lite_edge_ai_applications

TAICHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0927_winbond_innovative_cube_architecture_edge_ai.html?__locale=en

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market, wh...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=en

Winbond supplies the low-power, high-bandwidth 1Gb LPDDR3 DRAM die in the KL720 SoC Kneron’s KL720 with Winbond DRAM inside sets new industry benchmark for power/performance ratio in edge AI applications TAICHUNG, Taiwan – September 22, 2020 – Winbond Electronics Corporation, a leading global suppli...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/high-bandwidth-1gb-lpddr3-helps-kneron-kl720-achieve-1.4-tops-throughput-in-edge-ai.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/White-Paper-Revolutionizing-Edge-AI-Computing-with-CUBE

Winbond’s 4Gb LPDDR4X chip in 200B BGA package offers maximum 4267Mbps data rate at a clock rate up to 2133MHz TAICHUNG, Taiwan and Mountain View, CA– January 27, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, h...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/flex-logix-pairs-its-inferx-x1-ai-inference-with-winbond-4gb-low-power-ddr4x-in-edge-ai.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/-Memory-Architecture-for-AI-Edge-Systems

https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Joins-AI-Expo-2024-AIvolution

https://www.winbond.com/hq/support/online-learning/articles-item/Memory-Innovation-at-the-Edge-Power-Efficiency-Meets-Green-Manufacturing

https://www.winbond.com/hq/support/online-learning/articles-item/Memory-Solutions-Driving-Smarter-Smaller-Wearables

Micro ships its TX510 AI processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM TAICHUNG, Taiwan – December 16, 2020 – Winbond Electron...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-1gb-lpddr3-in-tsing-micro-new-ai-image-processing-soc.html?__locale=en

Winbond develops Mobile memory components with low power consumption, supporting not only smartphones and tablets but also extending to mobile consumer electronics and mobile communication applications. Winbond's Mobile DRAM devices support both x16 and x32 data bandwidths. The Mobile DRAM devices f...

https://www.winbond.com/hq/hq/product/customized-memory-solution/lpddr-lpsdr/index.html?__locale=en

A Camera or a Computer? AI and Machine Learning in Consumer Markets A long-forecast surge in the number of products based on artificial intelligence (AI) and machine learning (ML) technologies is beginning to reach mainstream consumer markets. It is true that research and development teams have foun...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-new-home-security-vision-systems-affects-the-choice-of-system-memory-technology.html?__locale=en