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Known Good Die (<span class="match">KGD</span>) Several customers utilize Winbond’s expertise in using flash products in Known Good Die (<span class="match">KGD</span>) for SIP (System In Package) solutions. Flash dies are stacked with Controller dies and put in a single package or module to provide SIP solutions. <span class="match">KGD</span> of other devices can also be stack...

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Winbond leverages advanced manufacturing processes to provide high-quality, high speed, and wide temperature range Known Good Die (<span class="match">KGD</span>) wafers. We also offer electrical simulation, wafer-level speed testing, and other services to enhance product compatibility with SOC for <span class="match">KGD</span> customers. Many custome...

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https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

Winbond launchs 32bit 32M/64Mb SDR/DDR <span class="match">KGD</span> for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launchs-32bit-sdr-ddr-kgd-for-SiP-application.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2

Winbond’s 256Mb HyperRAM 2.0e <span class="match">KGD</span> (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

Winbond’s HyperRAM™ product offers attractive combination of low pin count, low power consumption and high data bandwidth in miniature <span class="match">KGD</span> form factor TAICHUNG, Taiwan – January 13, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/gowin-embeds-winbond-64mb-hyperram-for-ai-edge-computing.html?__locale=en