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Taichung, Taiwan – 2024-08-07 - Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with low standby...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=en

As the world emerges from the Covid-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally on the way that medicine is practised. As a leading manufacturer of specialty memory ICs, Winbond is constantly look...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/new-wearable-medical-devices-calls-for-secure-high-density-memory.html?__locale=en

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-reveals-a-new-ultra-low-power-mobile-dram-at-2018-electronica.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/Winbond-HYPERRAM-Best-DRAM-Choice-for-AIoT-Application

Pseudo SRAM Pseudo-Static RAM (PSRAM) merges the advantages of dynamic RAM (DRAM) and static RAM (SRAM). By integrating an internal refresh circuit, PSRAM eliminates the need for external data-refresh operations, providing higher memory density, faster access speeds, and smaller chip size compared t...

https://www.winbond.com/hq/hq/product/customized-memory-solution/psram/index.html?__locale=en

Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

The W25QxxND 1.2V series of Serial NOR Flash has performance identical to the popular 3V and 1.8V families of serial flash with the added benefit of saving power. Packages offered: 2mm x 3mm USON8 narrow 150mil SOP8 6x5mm WSON 8-pin KGD (Known Good Die) The packages offered provide designers with th...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/index.html?__locale=en

New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en

Winbond develops Mobile memory components with low power consumption, supporting not only smartphones and tablets but also extending to mobile consumer electronics and mobile communication applications. Winbond's Mobile DRAM devices support both x16 and x32 data bandwidths. The Mobile DRAM devices f...

https://www.winbond.com/hq/hq/product/customized-memory-solution/lpddr-lpsdr/index.html?__locale=en

Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=en

New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=en

The edge artificial intelligence (AI) chipset market is expected to exceed the cloud AI chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge AI chipset market will reach US$12.2 billion in revenues, outpacing the cloud AI chipset market, wh...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=en

HyperRAMTM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=en

https://www.winbond.com/productResource-files/Winbond 1.2V Serial Flash Product Brief_EN_20250226.pdf

https://www.winbond.com/productResource-files/Winbond 1.2V Serial Flash Product Brief_EN_20250226.pdf