What’s Next for Memory: Why AI Demand Is Changing the Industry

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As we move further into 2026, the AI revolution is shifting from massive data centers directly to the "Edge." In our latest coverage from the Embedded World floor, we sat down with Winbond’s leadership to discuss how they are tackling the industry's biggest challenges: bandwidth, security, and the looming global supply shortage. Key Takeaways for Your Industry: 1. The Rise of CUBE: Discover how Winbond’s Customized Ultra-Bandwidth Element (CUBE) is delivering up to 8TB/s of bandwidth for IoT and Edge devices—bridging the gap between standard DRAM and the high cost of HBM. 2. Post-Quantum Security: Learn about the new W77T Secure Flash, designed with Post-Quantum Cryptography (PQC) to protect firmware against future quantum-computing threats. 3. Resilient Design: A deep dive into how Winbond is implementing NIST 800-193 standards to ensure hardware can detect, protect, and recover from sophisticated supply chain attacks.