English- Duration：03:44
- Views：5079
- Rate Us：
The emergence of AI is here! From AIoT to edge computing, processing and storing vast amounts of data with high computing power demands next-level memory solutions. Winbond provides a comprehensive portfolio of AI memory products—including high-bandwidth, low-power CUBE and GP-Boost DRAM, space-saving HYPERRAM™ for embedded AI, and high-speed Flash memory solutions delivering read throughput of up to 240 MB/s for automotive and industrial applications. Beyond performance, Winbond incorporates its TrustME® Secure Flash to safeguard your AI and AIoT devices with secure boot, secure OTA updates, and platform resilience against cyber threats. Watch the full video to see how Winbond's innovative memory solutions empower the future of AI!
On-demand Webinars
-
How to add multi-layered authentication into your IoTs?
In today’s connected world, there’s no denying tha...
-
New Generation of Advanced Flash for Connected Platforms
Today’s embedded applications demand innovative no...
-
Drop-in replacement Secure Flash for IoT devices - W77Q (Part 1)
In today's webinar, we are going to talk about... ...
-
Platform Firmware Security - W77Q (Part 2)
In today's webinar, you will learn... New W77Q Sec...
-
Higher Manufacturing Throughput and Faster OTA with Winbond QspiNAND and SpiStack® Flash
Winbond will introduce how faster erase and progra...
-
Root of Trust and Remote Attestation - W77Q (part 3)
The requirement for secure storage has grown recen...
-
Root of Trust and Remote Attestation - W77Q (part 3)
The requirement for secure storage has grown recen...