The requirement for secure storage has grown recently as more embedded systems have migrated to the IoT, opening previously closed systems to the threat of network-borne hacking attacks and malware.
W77Q is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations like OTA updates and device authentication.
Presenter:
Itay Admon | System Architect at Winbond Secure Flash Division
Register now!On-demand Webinars
-
Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated... Presenter: Jackson Huang / Winbond Electronics Corporation America
Higher Manufacturing Throughput and Faster OTA with Winbond QspiNAND and SpiStack® Flash
-
In today's webinar, you will learn... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting Secure Firmware Update, Secure Firmware Storage, Secure Boot. Register now for the security webinar. For further information or any question, please contact: TrustME@winbond.com Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Platform Firmware Security - W77Q (Part 2)
-
In today's webinar, we are going to talk about... New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication. Register now for the 8 minute security webinar. For further information or any question, please contact: TrustME@winbond.com Presenter: Itay Admon | System Architect at Winbond Secure Flash Division
Drop-in replacement Secure Flash for IoT devices - W77Q (Part 1)
-
Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms. As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories. SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package. Such stack memory enables a system to have both fast boot as well as storage of large O.S. and application software. The recently introduced 1.2V flash delivers more than 1/3 reduction in energy consumption thus extending the battery life of coin cell operated IOT devices. The Authentication product portfolio provides scalable, secured memory solutions allowing system developers to utilize existing flash memory layout to harden system level security without additional hardware. Presenter: Jackson Huang | Senior Marketing Director
New Generation of Advanced Flash for Connected Platforms
-
In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s W74M memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile memory products equips with multi-layered authentication to add a robust layer of security to IoT devices. The multi-layer authentication is accomplished with a “Challenge and Response” routine that involves the private root key and updated Monotonic Flash Counter value. Each W74M can provide authentication service up to four different hosts or systems to ensure that a product, consumables it uses, firmware it runs, accessories that support it and, the network nodes it connects to are not cloned or counterfeited. Presenter: CS Lin | Marketing Executive
How to add multi-layered authentication into your IoTs?