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Winbond Joins CYBERSEC 2024: Generative Future

  • Date:
    2024, May 14 - 16
    Location:
    TaiNEX 2
    Booth:
    AH02


Digital technology advances have led to a constant rise in cybersecurity threats, amplifying their impact and driving the continuous growth of the cybersecurity market. Winbond has always been vigilant about cybersecurity issues, and this year, in 2024, we are participating in CYBERSEC 2024 alongside globally renowned cybersecurity brands. We will showcase our latest cybersecurity solutions, working together to safeguard the digital future.

[Product Information]

Winbond Electronics Corporation has unveiled the latest extension of TrustME® Secure Flash W77Q family. These ground-breaking secure flash devices are the first in the market implementing Leighton–Micali Signature (LMS) algorithm for PQC (Post Quantum Cryptography), a critical enhancement for securing connected IoT edge devices used in commercial, industrial and server segments.

TrustME® W77Q series in densities of 256Mb, 512Mb, 1Gb are the cutting-edge technology, supporting asymmetric key cryptography algorithm and enabling devices to facilitate both Secure OTA with asymmetric PQC signatures and Secure Supply chain via LMS-OTS (NIST 800-208). Winbond is proud to be the first memory vendor to integrate PQC, meeting the emerging regulations requirements and setting a new standard in the industry. These devices are optimally designed for applications in Industrial IoT, networking, servers, and critical infrastructure applications.

We will demonstrate how the W77Q ensures and protects confidential and sensitive data across different applications, including OTA, IoT, and POS, as follows:

[Reference]

  1. For W77Q series product information, please refer to the latest press release: Winbond extends its secure flash with new memory densities, PQC support and secure supply chain management.
  2. For W77Q series product spec, please refer to W77Q product website.
  3. For more about TrustME® information, please refer to the TrustME® video.

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


Event contact
Yulia Lee
Marcom Manager
TEL: 886-3-5678168 Ext.75395
E-mail: YLLI5@winbond.com

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