Corporate Officers

• Arthur Yu-Cheng Chiao

  Chairman & CEO

  • Education
    • MS/ Major-Electrical Engineering/ University of Washington
    • BS/ Major-Telecommunication Engineering/ National Chiao Tung University
  • Major Experience
    • Chairman, Walsin Lihwa Corp.

• Tung-Yi, Chan

  Vice Chairman & Deputy CEO

  • Education
    • Ph.D. / Major-Electrical Engineering / University of California, Berkeley, USA
    • MS / Major-Electrical Engineering / University of California, Berkeley, USA
    • MS / Major-Management Science / Stanford University
    • BS / Major-Electrical Engineering / National Taiwan University
  • Major Experience
    • President, Winbond Electronics Corp.
    • CEO, BCD Semiconductor
    • Vice President of Sales Center, Winbond Electronics Corp.
    • Technology Executive, Winbond Electronics Corp.
    • President, Winbond Electronics Corp. America
    • AVP of Product Center III, Winbond Electronics Corp. America
    • Director of Research and Development Division I, Winbond Electronics Corp. America
    • Technology Manager, Siliconix
    • Technology Manager, Cypress
    • Senior Engineer, Intel

• Pei-Ming Chen

  President

  • Education
    • EMBA / Major-Business Administration  / National Taiwan University
    • MS / Major-Electrical Engineering / Detroit University
    • BS / Major-Electrical Engineering / National Cheng Kung University
  • Major Experience
    • Chairman, Nuvoton Technology Corp.
    • Vice President of DRAM Product Business Group, Winbond Electronics Corp.
    • Vice President of Sales Center, Winbond Electronics Corp.

• Pei-Lin Pai

  Vice President of Technology R&D Group

  • Education
    • Ph.D. / Major-Electrical Engineering / University of California, Berkeley, USA
    • MS / Major-Electrical Engineering / University of California, Berkeley, USA
    • BS / Major-Electrical Engineering / National Taiwan University
  • Major Experience
    • Vice President of Embedded Memory Business Group, Winbond Electronics Corp.
    • Vice President of Focal Tech Corp.
    • Vice President of Nanya Technology Corp.
    • President of Ascend Semiconductor Corp.
    • Marketing Director of Vanguard International Semiconductor Corp.
    • Engineering Vice President of Omega Micro Technologies, Inc.
    • Engineering Manager of Cypress Semiconductor Corp.
    • Senior Engineer, Intel.

• Hsiang-Yun Fan

  Vice President of DRAM Product Business Group

  • Education
    • MBA / Major- Business Administration / National Chung Cheng University
  • Major Experience
    • Vice President of General Administration Center, Nuvoton Technology Corp.

• Wen-Hua Lu

  Vice President of Memory IC Manufacturing Business Group

  • Education
    • MS / Major-Materials Science and Engineering / National Taiwan University
    • BS / Major-Chemical Engineering / National Tsing Hua University
  • Major Experience
    • Executive of Memory IC Manufacturing Business Group, Winbond Electronics Corp.
    • Executive of Kaohsiung Fab. Construction Planning Task Force, Winbond Electronics Corp.
    • Assistant Vice President of DRAM Product Marketing Center, Winbond Electronics Corp.
    • Assistant Vice President of 300mm Memory Product Manufacturing Center, Winbond Electronics Corp.
    • Director of 300mm Module Engineering Division, Winbond Electronics Corp.

• Jen-Lieh Lin

  Vice President of Flash Memory IC Business Group

  • Education
    • MS / Major-Materials Electrical Engineering / National Cheng Kung University
  • Major Experience
    • Vice President of Microcontroller Application Business Group, Nuvoton Technology Corp.
    • Assistant Vice President of Microcontroller Product Center, Nuvoton Technology Corp.
    • Assistant Vice President of System Technology Center, Winbond Electronics Corp.
    • Director of Micro Controller R&D Division, Winbond Electronics Corp.

• Jing-Fong Tsai

  Vice President of Quality and ESH Center

  • Education
    • Ph.D. / Major-Materials Science and Engineering / University of Utah, SLC, Utah, USA
    • MS / Major-Materials Science and Engineering / National Tsing Hua University
    • BS / Major- Metallurgy and Materials Engineering / National Cheng Kung University
  • Major Experience
    • Vice President of Sales Center, Winbond Electronics Corp.
    • Vice President of Technology and Chief Technology Officer, General Electronic Materials Corporation
    • Vice President, Eversol Corporation
    • Deputy director of QRA, United Microelectronics Corporation
    • Quality assurance supervisor, Phoenix Silicon International Corporation
    • Technical manager, Monsanto Electronic Materials Company
    • Senior process engineer, National Semiconductor Corporation
    • Research & development engineer, Metal Industries Research & Development Center

• Wen-Chang Hung

  Vice President of Sales Center

  • Education
    • MS / Major-Industrial Engineering and Systems Management / Chung Hua University
    • BS / Major-Industrial Engineering and Systems Management / Feng Chia University
  • Major Experience
    • Assistant Vice President of Sales Center, Winbond Electronics Corp.
    • Assistant Vice President of Flash Product Marketing Center, Winbond Electronics Corp.
    • Assistant Vice President of DRAM Product Marketing Center, Winbond Electronics Corp.
    • President, Winbond Electronics Ltd. Hong Kong