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Winbond’s W25QxxRV NOR Flash memory is currently available in densities ranging from 1Mb to 32Mb, with higher densities set to be launched soon. The RV family offers low power consumption, a compact form factor, and supports industrial temperatures up to 105°C, making it suitable for various markets and applications.

This whitepaper explores the innovative CUBE (Customized Ultra-Bandwidth Elements) technology developed by Winbond Electronics Corporation, designed to revolutionize AI computing on edge platforms. CUBE addresses the increasing demand for AI applications by providing a highbandwidth, power-efficient, compact, and cost-effective memory solution, as a ready-to-deploy technology available to module makers and System-on-Chip producers. This paper explains the purpose of CUBE, the end-user demands it addresses, its customer profile, and how it overcomes existing market shortcomings.

Winbond’s family of secure flash devices are designed with resiliency in their core. They address the 3 pillars of SP800-193 with sophisticated logic built directly into the hardware of the flash devices, providing the separate layer needed to handle resiliency.

Memory technology, exemplified by Winbond's solutions, continues to provide crucial support for CMS. With its remarkable cost-efficiency, Winbond's memory products are poised to accelerate the adoption of electronic side and rear-view mirrors, making them more accessible to drivers sooner than later.

The semiconductor industry, a crucial player in global decarbonization and electrification, recognises its role in environmental stewardship and has taken steps to align with global standards and initiatives aimed at improving industrial environmental performance. These include the environmental standard ISO 14001 and Reduction of Hazardous Substances.

How these tiny sensors change the fairness and accuracy in football is directly attributed to the chips supporting the underlying Technology. The success of edge computing will increasingly rely on indispensable internal memory as the Internet of Things moves us towards a more closely connected world...

With the evolution of automobiles to digitalization, the demand for data storage and the transmission of information is getting higher. All automotive applications require qualified storage products and devices that will endure in embedded environments exposed to extreme temperatures...

According to PwC's estimate, the metaverse market will exceed $1.5 trillion by 2030, with semiconductors being one of the key driving factors in its development. The semiconductor industry will likely usher in new growth with the progress of the metaverse market, with the strongest push coming from semiconductor products related to computing.

AI technology is divided into two categories; Training and Inference. AI-related chips include CPU, GPU, FPGA, TPU and, ASIC. To get an idea of how these chips compare to one another, here is a comparison focusing of 5 key factors...

ISO21434 has been made mandatory by many car makers and their component suppliers, starting from mid-2022. As a result, the automotive industry is now required to significantly improve how cyber threats are managed. As this standard applies to both the modules and their components, it requires the automotive industry to adapt devices capable of meeting this standard and provide the required protection against cyber threats.

Leveraging Octal interfaces for NAND flash memory will enable automotive, AI, consumer electronics, and industrial manufacturers to tap into this market growth opportunity by providing code storage in high density without having to pay a premium for NOR flash, a fast memory technology which scales poorly at densities above 512Mbits.

Automobile electronic systems are steadily becoming more intelligent. Advanced electronic functionality is being added throughout the vehicle such as ADAS, Gateway, Power Train, Infotainment, V2V, and V2X. These new capabilities are driving the need for increased security and safety.