Milestones - Winbond

Date

Milestones
Date 2013/12

Milestones Successful verification of NAND Flash with self-developed 46nm process technology
Date 2017/03

Milestones Winbond ranked as the top 10 companies of patent applications in Taiwan in the first quarter, 2017
Date 2017/06

Milestones Winbond Introduces First Very-Low-Voltage Flash Memories
Date 2012/01

Milestones Mass production of Flash product with self-developed 58nm process technology
Date 2012/12

Milestones Winbond is the top supplier of Serial NOR Flash memories worldwide
Date 2011/12

Milestones Mass production of DRAM product with self-developed 46nm process technology
Date 2017/06

Milestones Mass Production of DRAM product with self-developed 38nm process technology
Date 2017/06

Milestones Received “ The Third Corporate Governance Evaluation Award ” from Taiwan Stock Exchange and was listed as a component stock of “TWSE CG 100 Index ”and“ Taiwan HC100 Index”
Date 2017/07

Milestones Winbond TrustME^TM Secure Element passed Common Criteria EAL 5+ and EMVCo certificates
Date 2017/12

Milestones The Company issued 400,000,000 common shares at NT$22 per share. Accumulated capital is NT$39,800,001,93