SpiStack^® Combo Flash

W25M SpiStack^® Single Package Solution using the C2h Command to Control Concurrent Operation

To optimize board space and simplify system design, the W25M SpiStack^® Combo Flash combines multiple dies within a single standard SPI package and utilizes the C2h command for die selection, effectively eliminating the need for additional Chip Select (CS) pins. Each die operates independently and is individually addressable, allowing for versatile and efficient system operations. This architecture enables the system to read from one die while erasing or programming another, ensuring that code execution is not interrupted during updates. Furthermore, during initial programming or code updates, all dies can be erased and programmed simultaneously, greatly improving manufacturing throughput and making it an ideal solution for Firmware Over-The-Air (FOTA) updates.

SpiStack^® Combo Flash offers flexible configurations to meet diverse system requirements: Homogeneous Stacking connects identical dies (NOR+NOR or NAND+NAND), while Heterogeneous Stacking combines different memory types (NOR+NAND).

Homogeneous Stacking (Two or More Dies)

• NOR : Can be stacked to meet higher density requirements and is well-suited for automotive applications.
• NAND : Can be stacked to achieve higher density and faster Program/Erase performance.

Heterogeneous Stacking (Two or More Dies)

• NOR + NAND : Combines the familiarity and ease-of-use of booting from NOR Flash with the robust data storage capacity of NAND Flash.
• NOR + pSRAM : Combines the code storage reliability of NOR Flash with the high-speed working memory expansion of pSRAM.

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