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Winbond is the first company to offer the new spistack <span class="match">W25M</span> Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements.

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00012.html?__locale=en

New Devices Offer Unmatched Flexibility in Combining Densities for Variety of Applications SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – March 24, 2016 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash pr...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-spistack-in-8-Pin-packages.html?__locale=en

https://www.winbond.com/productResource-files/Winbond%20SpiStack%20Flash%20Product%20Brief.pdf

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