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SpiStack® Flash

DensityNOR16MbIndustrial StatusMass Production
NAND1Gb
Vcc2.7V - 3.6V
Feature ListNORSPI / QPI
UID & OTP Feature
Suspend/Resume
Volatile & Non-Volatile SR
SFDP		Frequency104MHz
PackageWSON8 8x6, BGA24
NANDOn-Chip 1-bit ECC Engine
Bad Block Management (BBM)
2KB Page Size and 64B Spare Area
Support OTP Memory Area		Temperature Range-40℃ ~ 85℃
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Technical Documentation

Resources

Winbond introduces the next generation 8Mb Serial Flash – W25Q80RV for low power and small form factor IoT devices

Product Press
As IoT devices become widely deployed in industrial factory automation and smart home control applications combining processing, connectivity, and sensor technologies in a system that is small and upgradeable, the demand grows for flash memories that come in small-form-factor packaging, consume a negligible amount of energy, and support fast software updates. The W25Q80RV is manufactured in Winbond’s own 12-inch wafer foundry utilizing the latest generation of Winbond’s 58nm technology. The die area is reduced by 40% compared to its predecessor which was built with 90nm technology.
W25Q80RV, 8Mb_Serial_Flash, low_power, IoT, KGD

Winbond SpiStack Flash Product Brief

Product Brief
SpiStack, W25M, stackingdies, smallformfactor, smallform, continuousread, SPI, 8pin
  • File Type：PDF
  • Updated：05/03/2023
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