EnglishThe W25M-AV SpiStack® integrates multiple independently addressable dies into a single package using the C2h command. Through heterogeneous NOR+NAND stacking, boot code can be placed on NOR for eXecute-in-Place (XiP) while other data resides on NAND. This architecture supports concurrent operations, allowing code execution to continue even during erase cycles, and enables simultaneous programming of all dies to boost manufacturing throughput.
Characteristics
- Voltage: 3V
- Density: NOR 32Mb + QSPI NAND 1Gb
- Interface: SPI, Dual, Quad
- Page size: 2048 + 64 byte
- Speed:
- NOR: STR 133MHz
- NAND: STR 104MHz
- Features:
- Bad Block Management Lookup Table (BBM LUT)
- Buffer and Continuous Read mode
- C2h command for die selection
Target Applications
- Human Machine Interface (HMI)
- Server, 5G, WiFi, and Switch
- Surveillance
- Field Programmable Gate Array (FPGA)
- Smart home
- Musical instruments
