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https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Joins-AI-Expo-2024-AIvolution

The edge artificial intelligence (<span class="match">AI</span>) chipset market is expected to exceed the cloud <span class="match">AI</span> chipset market for the first time in 2025. According to global tech market advisory firm, ABI Research, the edge <span class="match">AI</span> chipset market will reach US$12.2 billion in revenues, outpacing the cloud <span class="match">AI</span> chipset market, wh...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/low-density-lpddr4x-dram-for-edge-ai.html?__locale=en

T<span class="match">AI</span>CHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge <span class="match">AI</span> computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0927_winbond_innovative_cube_architecture_edge_ai.html?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/White-Paper-Revolutionizing-Edge-AI-Computing-with-CUBE

In March 2016, Google’s AlphaGo made history when it won a Go match with a 4:1 advantage, against Lee Sedol, an honorary 9 dan player from South Korea. Go, which originated in China over 3,000 years ago is a highly complex game that requires multiple layers of strategic thinking. Then, Google’s Alph...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/choosing-the-right-flash-memory-for-ai-endpoint-applications.html?__locale=en

Winbond supplies the low-power, high-bandwidth 1Gb LPDDR3 DRAM die in the KL720 SoC Kneron’s KL720 with Winbond DRAM inside sets new industry benchmark for power/performance ratio in edge <span class="match">AI</span> applications T<span class="match">AI</span>CHUNG, Taiwan – September 22, 2020 – Winbond Electronics Corporation, a leading global suppli...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/high-bandwidth-1gb-lpddr3-helps-kneron-kl720-achieve-1.4-tops-throughput-in-edge-ai.html?__locale=en

From these recent two year, IoT has changed from analyzing information from endpoint sensor or edge device to providing an on-time inference. This transformation, so call <span class="match">AI</span>oT, can reduce the system response time and overall system power consumption. It is already applied on smart speaker, smart doo...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00002.html?__locale=en

Winbond’s 4Gb LPDDR4X chip in 200B BGA package offers maximum 4267Mbps data rate at a clock rate up to 2133MHz T<span class="match">AI</span>CHUNG, Taiwan and Mountain View, CA– January 27, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, h...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/flex-logix-pairs-its-inferx-x1-ai-inference-with-winbond-4gb-low-power-ddr4x-in-edge-ai.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/GP-Boost-DRAM-for-AI-Applications

Micro ships its TX510 <span class="match">AI</span> processor with a Winbond 1Gb LPDDR3 die integrated into a single SiP Executing up to 1.2T(Int8), the TX510 SoC sets the pace in biometric and 3D sensing applications, backed by the 1866Mb/s bandwidth of the Winbond DRAM T<span class="match">AI</span>CHUNG, Taiwan – December 16, 2020 – Winbond Electron...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-1gb-lpddr3-in-tsing-micro-new-ai-image-processing-soc.html?__locale=en

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded <span class="match">AI</span> applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

Consumers have an insatiable demand for more functionality in their smart electronics – whether that be their mobile phones, consumer electronics devices, or auto entertainment systems. This is where storage selection has been and will continue to be, absolutely critical. All of these systems have b...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-rise-of-octalnand-for-automotive-ota-ai-and-more.html?__locale=en

(HSINCHU, Taiwan –29TH April, 2020) -- With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (<span class="match">AI</span>) technologies, the emerging application w/ <span class="match">AI</span> engine boosting to be powerful and popular in coming years. To image that the affordable <span class="match">AI</span>oT device can guide people how to...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-powering-aiot-and-8k-tv-with-1gb-lpddr3.html?__locale=en

The potential for innovation created by artificial intelligence (<span class="match">AI</span>) is exciting embedded developers in every market sector. In fact, it might seem strange to be thinking in terms of ‘innovation’, since the fundamental technology of <span class="match">AI</span> is not itself new: IBM’s Deep Blue <span class="match">AI</span> system beat chess world ch...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/why-embedded-developers-are-considering-serial-nand-in-ai.html?__locale=en