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<span class="match">CUBE</span> as the Solution <span class="match">CUBE</span> addresses the shortcomings of conventional memory IC and module solutions through novel approaches to increasing I/O count and raising data speed, support for Through-Silicon Via (TSV) technology as an option, and its 3D architecture that reduces thermal dissipation issues....

https://www.winbond.com/hq/hq/product/customized-memory-solution/cube/index.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/White-Paper-Revolutionizing-Edge-AI-Computing-with-CUBE

TAICHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (<span class="match">CUBE</span>) enable memory...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0927_winbond_innovative_cube_architecture_edge_ai.html?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

https://www.winbond.com/hq/about-winbond/news-and-events/events/product-promotion/Winbond-Joins-AI-Expo-2024-AIvolution

TAICHUNG, Taiwan– 2023-02-15 –Winbond has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe technology. This open industry standard defines interconnect between chiplets within a package, enabling an open chiplet ecosystem and ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_ucie_consortium_highperformance_chiplet_standardisation.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/Green-Manufacturing-A-Strategic-Imperative-for-Environmental-Sustainability