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HyperRAMTM devices with Wafer Level Chip Scale Package (<span class="match">WLCSP</span>) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W956D8MW.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-GAA110_21.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-GAA110_18.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA03-GAA110_15.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA04-GAA110_19.html&level=1

https://www.winbond.com/productResource-files/Winbond 1.2V Serial Flash Product Brief_EN_20250226.pdf

New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en

Pseudo SRAM Pseudo-Static RAM (PSRAM) merges the advantages of dynamic RAM (DRAM) and static RAM (SRAM). By integrating an internal refresh circuit, PSRAM eliminates the need for external data-refresh operations, providing higher memory density, faster access speeds, and smaller chip size compared t...

https://www.winbond.com/hq/hq/product/customized-memory-solution/psram/index.html?__locale=en

Winbond HyperRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Ambiq's Apollo4™ ultra-low power SoC is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices TAICHUNG, Taiwan– 2021-05-25– Winbond Elect...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-ambiq-collaborate-on-ultra-low-power-intelligent-iot-and-wearables.html?__locale=en

Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0615_winbond_next_generation_8mb_serial_flash_edge_device_constrained_iot_applications.html?__locale=en

CC EAL5+ certified W75F memory provides comprehensive protection for code and data New ASIL-D certification helps automotive manufacturers design systems for compliance with ISO26262 functional safety standard TAICHUNG, Taiwan – November 11, 2020 – Winbond Electronics Corporation, a leading global s...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/new-asil-d-boost-safety-and-security-credentials-on-w75f-secure-memory-element.html?__locale=en

https://www.winbond.com/hq/support/online-learning/articles-item/Green-Manufacturing-A-Strategic-Imperative-for-Environmental-Sustainability

Winbond Electronics Introduces Industry’s Smallest Serial Flash Memories for Space-Critical Applications Densities from 512Kb to 16Mb; USON, WLBGA Packages Reduce Footprint by 80% or more SAN JOSE, Calif., USA, and TAICHUNG, Taiwan– November 16, 2011 -- Winbond Electronics Corp., a leading global su...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-industrial-smallest-serial-flash-for-space-critical-applications.html?__locale=en

https://www.winbond.com/hq/hq/support/faq/technical/.content/faq/faq00001.html?__locale=en