Documentation - Winbond

Search results ：17 Matches

File Name

Category

Date

Format
File Name W63AH6NBV/W63AH2NBV 1G bits LPDDR3 General VFBGA 178 Ball (V3R02) Hspice Model

Category SPICE Model

Date 2021-07-12

Format zip
File Name W66BP6NB / W66CP2NQ SDP_2G/DDP_4G bits LPDDR4 Automotive 2-Layer WFBGA 200 Ball fullchip Hspice Model

Category SPICE Model

Date 2021-12-24

Format zip
File Name W66BP6NBHAFJ/W66BP6NBHAGJ/W66BP6NBHAHJ SDP_2G bits LPDDR4 2-Layer VFBGA 100 Ball fullchip Hspice Model

Category SPICE Model

Date 2022-06-05

Format zip
File Name W66BP6NBUAxJ / W66CP2NQUAxJ SDP_2G/DDP_4G bits LPDDR4 2-Layer WFBGA 200 Ball fullchip Hspice Model

Category SPICE Model

Date 2022-10-13

Format zip
File Name W66BQ6NB / W66CQ2NQ SDP_2G/DDP_4G bits LPDDR4x Automotive 2-Layer WFBGA 200 Ball fullchip Hspice Model

Category SPICE Model

Date 2021-12-24

Format zip
File Name W66BQ6NBUAxJ / W66CQ2NQUAxJ SDP_2G/DDP_4G bits LPDDR4x 2-Layer WFBGA 200 Ball fullchip Hspice Model

Category SPICE Model

Date 2022-10-17

Format zip
File Name W66xPxNxUAxJ/W66BP6NBHAxJ/W66xPxNxQAxJ SDP_2G/DDP_4G bits LPDDR4 2-Layer WFBGA200/TFBGA200/VFBGA100 Ball fullchip Hspice Model

Category SPICE Model

Date 2023-01-17

Format zip
File Name W66xPxNxUAxx/W66BP6NBHAxJ/W66xPxNxQAxx SDP_2G/DDP_4G bits LPDDR4 Automotive 2-Layer WFBGA200/TFBGA200/VFBGA100 Ball fullchip Hspice Model

Category SPICE Model

Date 2023-01-17

Format zip
File Name W66xQxNxQAxJ/W66BQ6NBHAxJ/W66xQxNxQAxx SDP_2G/DDP_4G bits LPDDR4x 2-Layer WFBGA200/TFBGA200/VFBGA100 Ball fullchip Hspice Model

Category SPICE Model

Date 2023-01-18

Format zip
File Name W66xQxNxUAxx/W66BQ6NBHAxx/W66xQxNxQAxx SDP_2G/DDP_4G bits LPDDR4x Automotive 2-Layer WFBGA200/TFBGA200/VFBGA100 Ball fullchip Hspice Model

Category SPICE Model

Date 2023-01-18

Format zip