Winbond Group announced today (15th) that it has once again been recognized as one of the Top 100 Global Innovators™ in 2024 by Clarivate™, a global leader in providing transformative intelligence, showcasing the group's active deployment of multinational patents to protect R&D achievements and its success in both quality and quantity of patent performance.
Winbond group, including Winbond Electronics Corporation, Nuvoton Technology Corporation, and Nuvoton Technology Corporation Japan, integrates the R&D capabilities of global colleagues to actively engage in technological development. We establish R&D bases worldwide, provide products and solutions cover markets such as the Internet of Things, smart industry, medical, automotive, computer communications, and consumer products, and protect innovative achievements through both patents and trade secrets. And, we are the only one in Taiwan with the ability to independently develop, design, and market DRAM, Flash, and Logic products. In 2023, Winbond Group's R&D expenditure accounted for approximately 23% of total revenue, and we currently have accumulated over 8,500 global granted patents, demonstrating our high regard for R&D resources.
Gordon Samson, President, Intellectual Property, Clarivate, said, “To feature as a Top 100 Global Innovator is no mean feat as maintaining an edge in the innovation ecosystem is harder than ever. Winbond demonstrates consistent innovative performance, especially in the success and leading technology of its inventions across the global market. We congratulate Winbond for being named a Top 100 Global Innovator for two consecutive years.”
Winbond stated that, in terms of innovation management, we focus on sustainable contributions and patent quality as the core of our intellectual property policy, and we continue to deploy patents for key technologies. In addition to evaluating innovation with patents, Winbond also incorporates a trade secret registration system to comprehensively record the trajectory of innovation, further strengthening the company's operations and intellectual property management. In the future, Winbond will continue to develop green technologies, integrate patent deployment strategies with operational goals, cover emerging application areas such as electric vehicles, autonomous driving, AI, energy conservation, and carbon reduction, and hope to jointly exert the sustainable innovation influence of the semiconductor industry with customers and partners.
Spokesperson
Chih-Chung Chou
Chief Financial Officer
TEL:
886-3-5678168
886-987-365682
News Liaison
Mandy Wang
TEL:
886-3-5678168 #71477
886-975-995525
E-mail:YCWang16@winbond.com