Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB. This benefit becomes more critical in small PCBs for applications like modules and designs with a small PCB area, particularly for mobile and portable applications.

Self-owned DRAM and SLC NAND Flash Technology

Winbond Electronics Corp. is a Memory IC Company engaged in DRAM and Flash design, manufacturing and sales services. From product design, research and development, wafer fabrication to marketing of brand name products, Winbond endeavors to provide its global clientele top quality of low to medium density memory solutions.

Self-owned 12-inch fab

Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of SLC code storage NAND flash memory and Mobile DRAM products. Our in house wafer fabrication provides customers with full commitment in capacity support as well as delivery flexibility.

Longevity Support

Winbond Electronics Corporation, a longtime provider of memory semiconductors, is now offering a Winbond Product Longevity Program (WPLP) for applications that require long-term support which offers stability and longevity for long-life applications that need support for 5+ to 10 years.


Ball Package Size(mm) MCP Part Number Density I/O Bus DRAM Type Status Automotive Purchase
Flash DRAM Flash DRAM
8x8x0.8 W71NW11GE1EW NAND + LPDDR2 1Gb 512Mb 16 16 LPDDR2 P UD

Status1:P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design, EOL=End of life.

Status2:All winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

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