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Winbond’s Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on PCBs (Printed Circuit Boards). One of the benefits of NAND flash is its non-...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/index.html?__locale=uk

TAICHUNG, Taiwan—2022-08-31 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that they had received the ISO/SAE 21434 certification from TÜV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world’s first memor...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_memory_vendor_ISO_SAE_21434_certification_road_vehicles_cybersecurity_management_System.html?__locale=uk

TAICHUNG, Taiwan—2023-08-08 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, is pleased to announce that their TrustME® W77Q Secure Flash family has received the prestigious ISO/SAE 21434 international standard certification. This certification is importa...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0808_iso_sae_21434_winbond_w77q_certification_memory_vendor.html?__locale=uk

Semiconductor Applications in Intelligent and Autonomous Vehicals Japan announced that it will demonstrate its autonomous vehicle technology during the Tokyo Olympics as the specific demonstration of intelligent automobiles in recent years. Driven by The Fifth Generation Mobile Networks (5G) and Art...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/automotive-solution-on-low-power-dram.html?__locale=uk

The potential for innovation created by artificial intelligence (AI) is exciting embedded developers in every market sector. In fact, it might seem strange to be thinking in terms of ‘innovation’, since the fundamental technology of AI is not itself new: IBM’s Deep Blue AI system beat chess world ch...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/why-embedded-developers-are-considering-serial-nand-in-ai.html?__locale=uk

Mobile phones have become an integral part of our daily lives providing a compact platform for work and play. With newer software requiring faster computing, optimized RAM makes all the difference. Low power DDR SDRAM is a synchronous DRAM optimized for numerous IoT applications. What Is a Low-Power...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr-sdram/index.html?__locale=uk

8M-bit 1.2V Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Features Dual/Quad Serial Peripheral Interface Uniform 4KB erasable sectors & 32KB/64KB erasable blocks 4,096 pages (256 bytes) Single/Dual/Quad Fast Read instructions 8/16/32/64byte wrap around for Fast Read Dual/Quad I/O in...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/1.2v-serial-nor-flash/item/W25Q80NE.html?__locale=uk

1Gb NAND + 512Mb LPDDR1 Features W29N01GZ NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x8 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GC1DW.html?__locale=uk

1Gb NAND + 512Mb LPDDR1 Features W29N01GZ NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x8 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GC3DW.html?__locale=uk

1Gb NAND + 512Mb LPDDR2 Features W29N01GZ NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x8 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GE3FW.html?__locale=uk

1Gb NAND + 1Gb LPDDR2 Features W29N01GZ NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : X8 – Operating temperature Industrial: -40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size:2,...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GF3FW.html?__locale=uk

1Gb NAND + 512Mb LPDDR1 Features W29N01GW NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x16 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page siz...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11GC1DW.html?__locale=uk

1Gb NAND + 512Mb LPDDR2 Features W29N01GW NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x16 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page siz...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11GE1EW.html?__locale=uk

1Gb NAND + 1Gb LPDDR2 Features W29N01GW NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x16 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size:...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11GF1EW.html?__locale=uk