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Winbond releases 256Mb LowPower DRAM
News
Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=uk
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Winbond Electronics Unveils 256MB LowPower DRAM
News
Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-unveils-256mb-low-power-dram.html?__locale=uk
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Winbond 1.2V Serial NOR Flash Product Brief
Code Storage Flash Memory1.2V Serial NOR FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf
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Winbond Displays Competitive IC Products at eMEX 2006
News
Winbond 2006 eMEX Date: October18-21 Location: Suzhou International Expo Center, Expo Plaza, Suzhou Industrial Park Booth: 4H02 , Hall 4A Winbond is going to show our latest products and solutions at eMEX 2006. Winbond is the leading ICs manufacturer in Taiwan. We design and manufacture ICs products...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-displays-competitive-ic-products-at-emex-2006.html?__locale=uk
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Winbond will Display Multiple Key Chips and IC Design Technologies at 2007 SemiTech Taipei Exhibition
Event
Winbond will attend the upcoming SemiTech Taipei (STT) Exhibition hosted by Taiwan Semiconductor Industry Association(TSIA) and Taipei Computer Association(TCA). Multiple Winbond IC designs as well as new products will be on display at theTaipei world Trade Center (May 10 th and 12 th). Our complete...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00012.html?__locale=uk
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Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China
News
Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-displays-multiple-key-chips-and-ic-design-technologies-at-2007-iic-china.html?__locale=uk
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Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
News
Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=uk
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The keys to successful adoption of new low-voltage memory ICs
Technical Article
Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=uk
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Keyword search results for “ lowpower ”, 8 Matches