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Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=ja

Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-unveils-256mb-low-power-dram.html?__locale=ja

https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf

Winbond 2006 eMEX Date: October18-21 Location: Suzhou International Expo Center, Expo Plaza, Suzhou Industrial Park Booth: 4H02 , Hall 4A Winbond is going to show our latest products and solutions at eMEX 2006. Winbond is the leading ICs manufacturer in Taiwan. We design and manufacture ICs products...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-displays-competitive-ic-products-at-emex-2006.html?__locale=ja

Winbond will attend the upcoming SemiTech Taipei (STT) Exhibition hosted by Taiwan Semiconductor Industry Association(TSIA) and Taipei Computer Association(TCA). Multiple Winbond IC designs as well as new products will be on display at theTaipei world Trade Center (May 10 th and 12 th). Our complete...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00012.html?__locale=ja

Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-displays-multiple-key-chips-and-ic-design-technologies-at-2007-iic-china.html?__locale=ja

ウィンボンドのHYPERRAM™が、低消費電力・少ピン数、グラフィックスの高速化、UIディスプレイのリフレッシュ最適化を実現 Mobiveil社のHYPERRAMコントローラIPにより、SoC設計者はウィンボンドのHYPERBUSベースHYPERRAM x8/x16 - 250 MHzメモリの活用が可能に (2023-08-30台湾台中市発)—半導体メモリソリューションの世界的リーディングサプライヤーである、ウィンボンド・エレクトロニクスと、シリコン知的財産（SIP）、プラットフォーム、IP対応設計サービスのサプライヤーとして急成長を遂げているMobiveil社は本日、オートモーティブ、スマー...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=ja

今日の産業機器及び民生機器の基板回路における電源電圧は、広範囲に渡ります。最も一般的な電源電圧は5V、3V、2.5V、1.8V、更に低電圧なものも存在します。　異なるメーカーのデバイス間における互換性を確保し、ボードレベルの電源設計を複雑化させないために、半導体メーカーはこれらの標準電源電圧にて動作するよう製品を設計します。　これらは安定性と互換性ためですが、それに反する要求も種々あります。それは、モビリティです。 モバイルやウェアラブル機器の需要は増え続け、モバイル製品にとって、電池のサイズと重量は、いうのはデザインにおける最大の課題です。小型電池を用いることで製品の小型化につながり、また余...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=ja