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Low Power DDR3 SDRAM

High bandwidth and cost advantages
For 1Gb x32 LPDDR3, it’s the alternative solution for developing high B/W (8.52GB/s) around 0.3W. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs.

expedite time to market: Today’s embedded system developers face challenges to upgrade LPDDR2 memory for new embedded SoC chips. Considering the migration path from LPDDR2 to LPDDR4, the IC design teams will need to invest more resources to deal with more critical signal integrity of LPDDR4 specification under tight timing margins. It is taking a great deal of time to verify and test the new design.

注:KGDに関するご用命は、こちらにご連絡ください。 

Density

Part No. Voltage Speed Temp. Organization Automotive Status Datasheet
W63CH6MBV 1.8V / 1.2V 800/933MHz -25℃~85℃ 256Mbit x16 - N pdf
W63CH2MBV 1.8V / 1.2V 800/933MHz -25℃~85℃ 128Mbit x32 - N pdf
ステイタス1:P=製造中 S=サンプル UD=開発中 N=設計改版中。
ステイタス2:全てのウィンボンド製品は、ハロゲンフリー、RoHS指令に基づいたパッケージングです。詳細や仕様に関しては、データシートをご参照ください。

Technical Documentation

Resources

Product Brief

Specialty DRAM and Mobile DRAM

Tags -
  • File Type:pdf
  • Updated:27/05/2020
Video

Ultra Low Power DRAM A “Green” Memory in IoT Devices

  • File Type:Video
  • Updated:11/12/2018
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