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低功耗雙存取同步動態隨機存取記憶體-第三代

High bandwidth and cost advantages
For 1Gb x32 LPDDR3, it’s the alternative solution for developing high B/W (8.52GB/s) around 0.3W. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs.

expedite time to market: Today’s embedded system developers face challenges to upgrade LPDDR2 memory for new embedded SoC chips. Considering the migration path from LPDDR2 to LPDDR4, the IC design teams will need to invest more resources to deal with more critical signal integrity of LPDDR4 specification under tight timing margins. It is taking a great deal of time to verify and test the new design.

附註: 如果有KGD的需求, 請連絡我們 

Density

Part No. Voltage Speed Temp. Organization Status Industrial & Commercial
Datasheet
Automotive Industrial & Commercial
W63AH6NBV 1.8V / 1.2V 800/933/1066 -25℃~85℃, -40℃~85℃ 64Mbit x16 - P pdf
W63AH2NBV 1.8V / 1.2V 800/933/1066 -25℃~85℃, -40℃~85℃ 32Mbit x32 - P pdf
Status1:P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
Status2:All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

Technical Documentation

Resources

Product Brief

GP-Boost DRAM Flyer

Tags -
  • File Type:pdf
  • Updated:28/07/2022
Product Brief

Specialty DRAM and Mobile DRAM

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  • File Type:pdf
  • Updated:27/05/2020
Video

Ultra Low Power DRAM A “Green” Memory in IoT Devices

  • File Type:Video
  • Updated:11/12/2018
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