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HyperRAMTM 裝置採用晶圓級晶片尺寸封裝 (WLCSP) 使尺寸規格變得更小、更簡單 (台灣台中訊，2020年6月10日) – 全球半導體儲存解決方案領導廠商華邦電子今日宣布，繼2019年發表HyperRAM™ 產品之後，進一步推出採用 WLCSP 的 HyperRAM™ 產品，在嵌入式應用中達到前所未有的薄型尺寸規格。 HyperBus™技術最早是由Cypress在2014年發表，相較於其他記憶體IC的傳輸控制介面， HyperBus™ 介面的特點之一是低接腳數，這使得電路板的布局較為簡潔, 佈線面積也較小。多家IC設計服務公司已推出HyperBus™的相關IP，這讓主晶片廠商在設計...

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華邦 HYPERRAM™ 提供低功耗和低引腳數，可加快圖形處理速度、優化UI顯示更新 Mobiveil 的 HYPERRAM™ 控制器 IP 允許 SoC 設計人員更好地利用華邦基於 <span class="match">HYPERBUS</span>™ 設計的HYPERRAM™ x8 / x16 - 250 MHz 記憶體 (2023-08-30臺灣台中訊)——全球半導體記憶體解決方案領導廠商華邦電子與快速增長的矽智慧財產權（SIP）、平臺與 IP 設計服務供應商 Mobiveil 今日宣佈，雙方將合作開發全新的 IP 控制器，將應用場景拓展至汽車、智慧 IoT、工業、可穿戴設備、TWS、智慧音箱和通訊等領域。 隨著智慧汽車、IoT、可穿戴設...

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