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相較傳統的pseudo SRAM,華邦HYPERRAM™為物聯網、消費設備、汽車和工業應用提供了更簡潔的記憶體解決方案。2021年量產的HYPERRAM™產品採用華邦25nm製成生產,其容量可擴展至256Mb和512Mb。封裝型態包含了24BGA, WLCSP和KGD。

HYPERRAM™有以下特性:

Density

Part No. Voltage Speed Temp. Organization Status Industrial & Commercial
Datasheet
Automotive Industrial & Commercial
W959D8NFY 1.8V 200MHz, 250MHz -40°C~85°C 16Mx8 P P pdf
W959D6NFK 1.8V 200MHz, 250MHz -40°C~85°C 32Mx16 - P pdf
Status1:P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
Status2:All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

Technical Documentation

Resources

Product Brief

DRAM HYPERRAM Flyer

Tags -
  • File Type:pdf
  • Updated:21/02/2023

Content
  • Updated:24/12/2021
Product Brief

GP-Boost DRAM Flyer

Tags -
  • File Type:pdf
  • Updated:28/07/2022
Video

Ultra Low Power DRAM A “Green” Memory in IoT Devices

  • File Type:Video
  • Updated:11/12/2018
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