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相较传统的pseudo SRAM,华邦HYPERRAM™为物联网、消费设备、汽车和工业应用提供了更简洁的内存解决方案。2021年量产的HYPERRAM™产品采用华邦25nm工艺生产,其容量可扩展至256Mb和512Mb。封装型态包含了24BGA, WLCSP和KGD。

HYPERRAM™有以下特性

Density

Part No. Voltage Speed Temp. Organization Status Industrial & Commercial
Datasheet
Automotive Industrial & Commercial
W959D8NFY 1.8V 200MHz, 250MHz -40°C~85°C 16Mx8 P P pdf
Status1:P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
Status2:All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.

Technical Documentation

Resources

Product Brief

GP-Boost DRAM Flyer

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  • File Type:pdf
  • Updated:28/07/2022
Product Brief

Specialty DRAM and Mobile DRAM

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  • File Type:pdf
  • Updated:27/05/2020
Video

Ultra Low Power DRAM A “Green” Memory in IoT Devices

  • File Type:Video
  • Updated:11/12/2018
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