High bandwidth and cost advantages
For 1Gb x32 LPDDR3, it’s the alternative solution for developing high B/W (8.52GB/s) around 0.3W. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs.
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expedite time to market:
Today’s embedded system developers face challenges to upgrade LPDDR2 memory for new embedded SoC chips. Considering the migration path from LPDDR2 to LPDDR4, the IC design teams will need to invest more resources to deal with more critical signal integrity of LPDDR4 specification under tight timing margins. It is taking a great deal of time to verify and test the new design.
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| LPDDR2 | LPDDR3 | |
|---|---|---|
| Data Rate | 800~1066Mbps | 1600~1866Mbps |
| Density | 1Gb~2Gb | 1Gb |
| Interface | LVCMOS compatible | HSUL_12 with ODT |
| Number of Banks | 4 | 8 |
| Pre-fetch | 4 | 8 |
| Burst Length | 4/8/16 | 8 |
