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W955D8MBYA 32Mb HyperBus pSRAM TFBGA24 datasheet_A01-002_20220916
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA00-W955D8MBYA.html&level=1
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W958D8NBYA5S 256M bits HyperBus pSRAM TFBGA 24 Ball IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-GAA110_23.html&level=4
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W956D8MBYA5I 64M bits HyperBus pSRAM TFBGA 24 Ball IBIS(5.0) Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-CAA104_26.html&level=1
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W958D8NWSXxI 256M bits HyperBus pSRAM WLCSP 30 Ball fullchip Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA04-GAA110_21.html&level=1
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W959D8NFYA5S 512M bits HyperBus pSRAM DDP TFBGA 24 Ball fullchip Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA04-GAA110_25.html&level=4
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W958D8NBYA5S 256M bits HyperBus pSRAM TFBGA 24 Ball fullchip Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA04-GAA110_26.html&level=4
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W958D8NBYA4I/W958D8NBYA5I 256M bits HyperBus pSRAM TFBGA 24 Ball IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-GAA110_19.html&level=4
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W959D8NFYA5S 512M bits HyperBus pSRAM DDP TFBGA 24 Ball IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-GAA110_22.html&level=4
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W958D8NWSX5I/W958D8NWSX4I 256M bits HyperBus pSRAM WLCSP 30 Ball IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-GAA110_18.html&level=1
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W959D8NFYA5x 512M bits HyperBus pSRAM DDP TFBGA 24 Ball fullchip Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA04-GAA110_24.html&level=4
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W958D8NBYA5A/W958D8NBYA5K 256M bits HyperBus pSRAM Automotive TFBGA 24 Ball IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-GAA110_5.html&level=4
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华邦电子HyperRAM™推出WLCSP封装引领穿戴式装置的时代
News
HyperRAMTM 装置采用晶圆级芯片尺寸封装 (WLCSP) 使尺寸规格变得更小、更简单 (台湾台中讯,2020年6月10日) – 全球半导体内存解决方案领导厂商华邦电子今日宣布,继2019年发表HyperRAM™ 产品之后,进一步推出采用 WLCSP 的 HyperRAM™ 产品,在嵌入式应用中达到前所未有的薄型尺寸规格。 HyperBus™技术最早是由Cypress在2014年发表,相较于其他内存IC的传输控制接口, HyperBus™ 接口的特点之一是低接脚数,这使得电路板的布局较为简洁, 布线面积也较小。多家IC设计服务公司已推出HyperBus™的相关IP,这让主芯片厂商在设计内...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=zh
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华邦电子与Mobiveil合作开发HYPERRAM控制器, 不断拓宽超低功耗应用场景
News
华邦 HYPERRAM™ 提供低功耗和低引脚数,可加快图形处理速度、优化UI显示刷新 Mobiveil的HYPERRAM™控制器使SoC设计人员能够更好的利用华邦基于<span class="match">HYPERBUS</span>™设计的 HYPERRAM™ x8/x16 - 250MHz内存 (2023-08-30台湾台中讯)——全球半导体存储解决方案领导厂商华邦电子与快速增长的硅知识产权(SIP)、平台与 IP 设计服务供应商 Mobiveil 今日宣布,双方将合作开发全新的 IP 控制器,将应用场景拓展至汽车、智能 IoT、工业、可穿戴设备、TWS、智能音箱和通讯等领域。 随着智能汽车、IoT、可穿戴设备等应用对于功耗的要求越来越严格...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=zh
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W959D8NFYA5I/W959D8NFYA4I 512M bits HyperBus pSRAM DDP TFBGA 24 Ball fullchip Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA04-GAA110_22.html&level=1
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W958D8NBYA4I/W958D8NBYA5I 256M bits HyperBus pSRAM TFBGA 24 Ball fullchip Hspice Model
SPICE Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA04-GAA110_20.html&level=1
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